By the end of 2009 the company intends to have expanded its wafer capacity at its Taiwanese factory from 300 megawatts (MW) to 360MW, while growing its wafer-slicing capacity from 235MW to 300MW.
It will expand both its ingot and wafer production capacity at its smaller factory in Shandong, China to 50MW by 2010.
The company says that it will continue expanding production in the future as it seeks to "catch the ramping domestic market" in China.
