The German company’s MicroScribeOne-Stop-Patterning (OSP) technique only structures the modules once all of thefunctional layers have been deposited on the substrate, streamlining theproduction process and reducing inaccuracies caused by misalignment.

Thin-film modules are currentlystructured with a laser unit after each individual layering stage, calling forexpensive cleaning steps that lead to extended processing times and knock-onefficiency losses.

Between the layering and structuring, modules are passed inand out of a vacuum chamber several times, which can cause 200-400-micrometre-wide “dead zones” to be formed during fabrication.

“Our