Existing shareholders Siemens Venture Capital, ARCH Venture Partners and Intersouth Partners contributed to the investment round.
"We appreciate the continued support of our investors and our board of directors," says Semprius chief executive Joe Carr. "This investment will enable us to address increasing demand for our high-efficiency modules with meaningful commercial volumes in 2013."
Semprius is developing a high CPV module design based around a proprietary micro-transfer printing process that makes possible the parallel transfer of many pre-formed circuit elements from a source semiconductor wafer to a wide range of substrates.
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